Chips, electronic devices in the production and manufacturing process, the need to detect and analyze the parts or causes of their damage, unusually difficult. Infrared detection can be used to locate the failure of tiny devices through the temperature distribution of their working state, providing an effective detection tool for research and development personnel.

1. circuit board design optimization and fault detection: Thermal imaging technology can capture the heat emitted by electronic components in real time, through the visualization of thermal information, rapid detection of product defects and faults, to help R & D personnel to assess the thermal distribution, locate the thermal load of the excessive areas, optimize the thermal design.

2. Optimization of heat dissipation components: By imaging the temperature distribution of the product, thermal imaging technology helps R&D personnel to evaluate the effect of different heat dissipation solutions, screen for suitable heat dissipation materials, and consider performance indicators and costs.

3. circuit welding temperature monitoring: in the production of integrated circuits, thermal imaging technology to monitor the temperature of the welding process in real time, generating temperature curves to help engineers optimize the welding time, improve yield and reduce waste.

4. chip performance testing: the use of thermal imaging technology, non-contact temperature measurement characteristics, you can test the chip in the limit conditions of the heat, for chip performance optimization to provide data reference.

5. chip aging test: in the circuit board aging test, thermal imaging technology to monitor the product temperature changes, assess product performance, and prevent failures and fires in the aging process.